XCVU37P-2FSVH2892E | Xilinx Virtex UltraScale+ FPGA, 2851800 Logic Cells, 2892-Ball BGA

Xilinx · Industrial Automation & Electrical

Description  The XCVU37P-2FSVH2892E is a high-performance FPGA from the Xilinx Virtex UltraScale+ family, designed for compute-intensive and memory-focused applications. Featuring over 2.8 million logic cells and support for advanced memory interfaces, it is suitable for next-generation networking, signal processing, and data center acceleration.     Technical Specifications  Condition New/Never Used Surplus Brand Xilinx Category Programmable Logic Part Number XCVU37P-2FSVH2892E Subcategory Field Programmable Gate Arrays (FPGAs) Product Type Field Programmable Gate Array (FPGA) Series Virtex UltraScale+ Logic Cells 2,851,800 CLBs 162,960 I/Os 624 inputs, 624 outputs Package Type BGA2892 (S-PBGA-B2892, 55×55 mm) Terminal Pitch 1.0 mm Seated Height Max 4.51 mm Voltage Range (Core) 0.825 V – 0.876 V (0.85 V nominal) Operating Temperature Up to +100 °C Moisture Sensitivity Level (MSL)  4 Terminal Finish Tin-Silver-Copper (e1) Reflow Temperature Max 240 °C (30 seconds max) Surface Mount Yes ECCN Code 3A001.A.7.B RoHS / REACH Compliance Yes HTS Code 8542.39.00.01 Weight 0.02 kg       Information About XCVU37P-2FSVH2892E The XCVU37P-2FSVH2892E is part of Xilinx’s UltraScale+ series, offering a robust architecture with 162,960 configurable logic blocks (CLBs) and a total of 2,851,800 logic cells. Housed in a 2892-ball BGA package (55 mm × 55 mm, 1 mm pitch), the device supports a nominal core voltage of 0.85 V and operates up to 100 °C. It is surface-mountable and uses the HIPERFACE DSL® communication interface. The part conforms to RoHS and REACH compliance standards and features extended temperature grading and tin-silver-copper ball terminal finish. Designed for high-throughput, low-latency applications, this part supports 624 I/O channels and a peak reflow temperature of 240 °C. Key Features: High Logic Density: Contains 2,851,800 logic cells organized into 162,960 CLBs. Large I/O Count: Supports 624 inputs and 624 outputs for high connectivity. Advanced Package: BGA2892 package (55×55 mm, 1 mm pitch) with max height of 4.51 mm. Low Core Voltage: Operates at 0.85 V nominal, supporting low power consumption. Extended Temp Range: Operates up to +100 °C for industrial-grade environments. RoHS & REACH Compliant: Meets environmental and safety standards. Moisture Sensitivity Level 4: Requires controlled storage and handling. The XCVU37P-2FSVH2892E delivers the capacity, speed, and reliability required for advanced FPGA-based computing solutions.

Brand: Xilinx · Category: Industrial Automation & Electrical

Key features

• High Logic Density: Contains 2,851,800 logic cells organized into 162,960 CLBs.
• Large I/O Count: Supports 624 inputs and 624 outputs for high connectivity.
• Advanced Package: BGA2892 package (55×55 mm, 1 mm pitch) with max height of 4.51 mm.
• Low Core Voltage: Operates at 0.85 V nominal, supporting low power consumption.
• Extended Temp Range: Operates up to +100 °C for industrial-grade environments.
• RoHS & REACH Compliant: Meets environmental and safety standards.
• Moisture Sensitivity Level 4: Requires controlled storage and handling. The XCVU37P-2FSVH2892E delivers the capacity, speed, and reliability required for advanced FPGA-based computing solutions.

Specifications

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